Home / Events / ACM Tangible, Embedded, and Embodied Interaction Conference
NEXT EVENT: Wednesday March 20 2019
8 a.m.-8 p.m.

ACM Tangible, Embedded, and Embodied Interaction Conference

March 17–20

ACM TEI 2019 is the 13th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. Hosted by the School of Arts, Media, and Engineering.

Research areas: Interaction design, media art, wearable computing, smart materials, design research, interactive learning environments.

The TEI conference presents top-tier work in interaction design, engineering, smart materials, user experience, design research and interactive art. Our 2019 conference theme is Hybrid Materials, and our program covers topics in assistive technology, wearables, biometrics, on-body and in-body computing, AI, and media art, as well as critical and theoretical perspectives on these topics.

This conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations, and performances. 

Previews of featured work on our Facebook page: https://www.facebook.com/teiconf.

Our conference registration is now open, please join us for this exciting event in March.

For more information please contact:
Kayla Elizondo
School of Arts, Media and Engineering
Tempe campus